发明名称 SUBSTRATE BREAKING APPARATUS AND SUBSTRATE BREAKING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate breaking apparatus capable of accurately positioning a breaking position even when a brittle material substrate to be broken is thin and is broken with a small pitch. <P>SOLUTION: The substrate breaking apparatus includes: an elastic film 4; the upper breaking bars 6a and 6b which are arranged to enable vertical movement above the elastic film 4 and break along a scribing line 11; and a lower breaking bar 5 which is arranged to enable vertical movement under the elastic film 4 and breaks along the scribing line 11. Breaking is performed in such a state that the lower breaking bar 5 and a first upper breaking bar 6a pinch the brittle material substrate 1 by pressure-contacting the lower breaking bar 5 along the scribing line 11 opposite the side at which the scribing line 11 is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012035639(A) 申请公布日期 2012.02.23
申请号 JP20110254016 申请日期 2011.11.21
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人
分类号 B28D5/00 主分类号 B28D5/00
代理机构 代理人
主权项
地址