LIGHT EMITTING DIODE HAVING MULTI-CELL STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a light emitting diode having a multi-cell structure including a plurality of unit cells, which reduces optical loss and enhances optical efficiency in a light emitting diode surface due to a bonding pad which is formed for a contact between an existing mesa-etching region for forming an electrode of a n-type semiconductor layer and a p-type semiconductor layer. Additionally, the invention allows the adjustment of chip size even if the same chip manufacturing process as the prior art is used, thereby manufacturing different sizes of chips. More specifically, one aspect of the present invention provides the light emitting diode having a multi-cell structure including the unit cells, comprising: a transparent substrate; a first semiconductor layer, an active layer, and a second semiconductor layer which are sequentially formed on the transparent substrate; a plurality of holes which are formed apart from each other by removing the second semiconductor layer and a part of the active layer; a first electrode which is in contact with the first semiconductor layer through some holes among the plurality of holes and an upper surface of which is exposed to the outside; a first protective layer which surrounds a lateral periphery of the first electrode to prevent a short circuit between the first semiconductor layer and the second semiconductor layer; a second protective layer which is formed at the lateral surfaces and lower surfaces of the holes in which the first electrode is not formed; a reflective layer or a current diffusion layer which is formed on the second protective layer and the second semiconductor layer; and a second electrode which is formed on the reflective layer or the current diffusion layer.