发明名称 LIGHT-EMITTING DIODE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting diode having an improved heat dissipation effect. <P>SOLUTION: A light-emitting diode according to the present invention comprises: a heat dissipation component; a dielectric layer; an electrically conductive layer; a heat conductive layer; and a light-emitting unit. The heat dissipation component has an upper surface. The dielectric layer is formed on the upper surface of the heat dissipation component. The dielectric layer has a first hole part through which a local part of the upper surface of the heat dissipation component is exposed to the outside. The electrically conductive layer is formed on the dielectric layer. The electrically conductive layer has a plurality of conducting wires and a second hole part that at least partially overlaps the first hole part and through which the local part of the upper surface of the heat dissipation component is exposed to the outside. The heat conductive layer is formed in the first hole part and the second hole part and is bonded to the upper surface of the heat dissipation component. The light-emitting diode is bonded to the heat dissipation component through the heat conductive layer, which makes it possible to conduct heat of the light-emitting diode directly to the heat dissipation component through the heat conductive layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012039071(A) 申请公布日期 2012.02.23
申请号 JP20110039977 申请日期 2011.02.25
申请人 GETAC TECHNOLOGY CORPORATION 发明人
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
代理机构 代理人
主权项
地址