| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate which has a high degree of freedom in material selection, and to provide a method of manufacturing the substrate. <P>SOLUTION: An electronic component built-in substrate 1 comprises a first structure 10 which includes: a substrate 11 in which a wiring pattern 14 formed on a surface 12a of a substrate body 12 electrically connects with a wiring pattern 15 formed on a surface 12b with a through via 13 interposed therebetween; and an electronic component 16 electrically connecting with the wiring pattern 14. Further, the electronic component built-in substrate 1 has a sealing resin 20 formed so as to seal the first structure 10 and a wiring pattern 32 which connects with the wiring pattern 15 with a via 31 interposed therebetween. <P>COPYRIGHT: (C)2012,JPO&INPIT |
