SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

A semiconductor device (25) comprises: a semiconductor chip (4); an outer pad (7) which is formed on a peripheral portion of a main surface of the semiconductor chip (4); a plurality of inner pads (8, 9) which are formed inside the outer pad (7) on the main surface; a protective film (6) which covers the main surface and has openings above the outer pad (7) and the plurality of inner pads (8, 9); and a first fine metal wire (16) which electrically connects the inner pads with each other. The plurality of inner pads (8, 9) are smaller than the outer pad (7).