| 摘要 |
<p>An electronic part and method of manufacturing same that are capable of reducing manufacturing costs and improving design freedom for substrate surfaces are provided. The electronic part comprises a substrate (12), first electronic parts (2, 4) mounted on a first main surface (12a) of the substrate (12), a first resin layer (20) which covers the first electronic parts (2, 4) and the main surface (12a) of the substrate (12), a second electronic part (6) mounted on a second main surface (12b) of the substrate (12), a second resin layer (30) which covers the second electronic part (6) and the second main surface (12b) of the substrate (12), a conductive shield layer (42), and a ground electrode (18) formed on the substrate (12) so as to reach a side surface (12s) of the substrate (12). The shield layer (42) is integrally formed so as to continuously cover the first resin layer (20), the side surface (12s) of the substrate (12), and the part of the second resin layer (30) adjacent to the substrate (12), is in contact with the ground electrode (18), and is electrically connected to the ground electrode (18).</p> |
