| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer adhesive sheet which ensures easy peeling between an adhesive layer and a die attach film during pickup even when an acrylic acid ester copolymer is used in the die attach film, thus facilitating pickup work of a semiconductor chip after dicing. <P>SOLUTION: The multilayer adhesive sheet has an adhesive layer laminated on one surface of a base film, a die attach film laminated on the exposed surface of the adhesive layer. An adhesive composing the adhesive layer has a (meta)acrylic acid ester copolymer (A), an ultraviolet ray polymerizable compound (B), a polyfunctional isocyanate hardener (C), a photopolymerization initiator (D), and a silicon polymer (E). <P>COPYRIGHT: (C)2012,JPO&INPIT |
