| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for suspension with support frame for preventing any plated part which is unnecessary for a metallic support substrate from being formed in a case of forming a wiring plated part. <P>SOLUTION: Disclosed is a substrate for suspension with support frame configured such that a substrate for suspension and a support frame are integrally formed in the internal opening area of the support frame. In the substrate for suspension, a wiring plated part is formed in a portion of a wiring layer, and in the support frame, an insulating area in which a portion of a conductor layer is chipped is formed, and the insulating area is formed so that the internal opening area can be surrounded. Thus, the conductor layer positioned outside the insulating area and the wiring layer positioned inside the insulating area are insulated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
