| 发明名称 |
ACF STICKING DEVICE FOR FPD MODULE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ACF sticking device which applies uniform pressurizing force over the entire length of the ACF when sticking the ACF on a substrate. <P>SOLUTION: The ACF sticking device for an FPD module includes a pressure-bonding blade 51 for pressure-bonding an ACF 8 to a substrate 2 having electrodes formed thereon, and a cap member 52. The cap member 52 is configured to cover a front end of the pressure-bonding blade 51 and to have elasticity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012038747(A) |
申请公布日期 |
2012.02.23 |
| 申请号 |
JP20100174363 |
申请日期 |
2010.08.03 |
| 申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
NOMOTO HIDEKI;KANEKO TATSUO;KITANO KEISHO |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
