| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic bonding controller capable of determining whether the bonded state is good or not even if a workpiece to be bonded having a small oscillation amplitude is subjected to the ultrasonic joining, and detecting a poor bonding, a crack failure or an abnormal bonding peeling inexpensively. <P>SOLUTION: The ultrasonic bonding controller bonds a bonding member (121) and a workpiece (120) to be bonded with an ultrasonic oscillator (132) driven from an oscillator drive voltage source (332), and a first vibratory sensor (152) does not detect a mechanical vibration of the workpiece (120) or the bonding member (121) and detects a generation of friction vibration caused by sliding friction and a disappearance of friction vibration caused by a finish of boding to determine the bonded state. <P>COPYRIGHT: (C)2012,JPO&INPIT |
