LAMINATION PROCESS FOR LEDS

摘要

A method is described for laminating a layer (28) over an array of LED dies (10) on a submount wafer (12). The layer (28) may comprise phosphor powder in a silicone binder. The layer is formed on a support film (26) then dried. The layer is then mounted over the LED dies (10), and the structure is heated in a vacuum. Downward pressure is placed on the support film (26) so that the layer adheres to the tops of the LED dies and forms an airtight seal around the periphery of the wafer. The structure is then exposed to ambient air, and the support film (26) is removed. The seal prevents ambient air from entering between the layer (28) and the wafer (12). In a second lamination step, the structure is heated to a higher temperature in a vacuum to remove the remaining air between the layer and the wafer. The structure is then exposed to ambient air pressure, which conforms the heated layer to the LED dies.