| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist pattern formation method for forming a resist pattern having higher adhesion with a supporting body with a method simpler than before. <P>SOLUTION: The resist pattern formation method includes a step (1) for coating a resist composition on a substrate directly, a step (2) for forming a resist film by baking the substrate on which the resist composition is coated, a step (3) for cleaning the substrate on which the resist film is formed with an organic solvent, and a step (4) for forming a resist pattern by coating the same resist composition as the resist composition coated initially on the substrate after the cleaning. <P>COPYRIGHT: (C)2012,JPO&INPIT |
