发明名称 PLASMA PROCESSES AT ATMOSPHERIC PRESSURE
摘要 The invention relates to an apparatus for treatment of surfaces of a substrate by means of a plasma. The apparatus comprises a plasma source which is designed to produce a plasma and to emit into a plasma area with a longitudinal plasma extent which runs along a main movement component of the plasma, an at least partially conductive first holding apparatus, which is designed to hold a first workpiece, and a voltage source which is connected to the first holding apparatus and is designed to produce a first acceleration voltage, and to apply this to the first holding apparatus. The first holding apparatus is arranged and designed relative to the plasma source to place the first workpiece such that the plasma reaches the first workpiece when the first acceleration voltage is applied.
申请公布号 WO2012022738(A1) 申请公布日期 2012.02.23
申请号 WO2011EP64075 申请日期 2011.08.16
申请人 FORSCHUNGSVERBUND BERLIN E. V.;GESCHE, ROLAND;PORTEANU, HORIA-EUGEN;KUEHN, SILVIO 发明人 GESCHE, ROLAND;PORTEANU, HORIA-EUGEN;KUEHN, SILVIO
分类号 H01J37/32;H05H1/42 主分类号 H01J37/32
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