| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting package which forms an electrode on a back surface without limitation to patterns by a simple process at low cost and uses a metal substrate to achieve good heat radiation. <P>SOLUTION: In a light emitting package, a light emitting element 30 is mounted on a metal substrate 10 and is sealed by a resin 22. An electrode pattern including at least one independent electrode 10a is formed at a resin sealing part of the metal substrate 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
