发明名称 |
Composite Carrier Structure |
摘要 |
A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.
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申请公布号 |
US2012045611(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US20100858211 |
申请日期 |
2010.08.17 |
申请人 |
SHIH YING-CHING;WU WENG-JIN;LIN JING-CHENG;CHIOU WEN-CHIH;JENG SHIN-PUU;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SHIH YING-CHING;WU WENG-JIN;LIN JING-CHENG;CHIOU WEN-CHIH;JENG SHIN-PUU;YU CHEN-HUA |
分类号 |
H01L23/12;B32B3/24;B32B3/26;B32B7/12;B32B17/06;B32B37/02;B32B37/12;B32B38/10;H01L21/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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