发明名称 |
METHOD TO PLANARIZE THREE-DIMENSIONAL STRUCTURES TO ENABLE CONFORMAL ELECTRODES |
摘要 |
Methods for fabricating three-dimentional PIN structures having conformal electrodes are provided, as well as the structures themselves. The structures include a first layer and an array of pillars with cavity regions between the pillars. A first end of each pillar is in contact with the first layer. A segment is formed on the second end of each pillar. The cavity regions are filled with a fill material, which may be a functional material such as a neutron sensitive material. The fill material covers each segment. A portion of the fill material is etched back to produce an exposed portion of the segment. A first electrode is deposited onto the fill material and each exposed segment, thereby forming a conductive layer that provides a common contact to each the exposed segment. A second electrode is deposited onto the first layer. |
申请公布号 |
US2012043632(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US201113014879 |
申请日期 |
2011.01.27 |
申请人 |
NIKOLIC REBECCA J.;CONWAY ADAM M.;GRAFF ROBERT T.;REINHARDT CATHERINE;VOSS LARS F.;SHAO QINGHUI |
发明人 |
NIKOLIC REBECCA J.;CONWAY ADAM M.;GRAFF ROBERT T.;REINHARDT CATHERINE;VOSS LARS F.;SHAO QINGHUI |
分类号 |
H01L31/115;H01L31/18 |
主分类号 |
H01L31/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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