| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element which can sufficiently reduce resist damage, and has excellent developing properties and resolution in pattern formation. <P>SOLUTION: A photosensitive element includes a support film, and a photosensitive resin composition layer formed on the support film. In the photosensitive element, the haze of the support film is 0.01 to 2.0%, the total number of particles having a diameter of 5 μm or more and aggregate having a diameter of 5 μm or more which are included in the support film is 5 pieces/mm<SP POS="POST">2</SP>or less. The photosensitive resin composition layer contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photoinitiator. The binder polymer has 60 to 130 mgKOH/g of acid value x, and a weight average molecular weight Mw satisfying a relationship represented by the expression (I): 10,000≤Mw<4,000e<SP POS="POST">0.02x</SP>. <P>COPYRIGHT: (C)2012,JPO&INPIT |
