| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces the radiation loss when circuits are interconnected by a wire. <P>SOLUTION: A step surface 41 lower than a surface of a central region is provided on the periphery of a metal base substrate 10. A sidewall part 16b made of an insulator penetrated by a band-like conductor 18b is arranged on the step surface 41 so that the band-like conductor 18b has the same height as a circuit pattern 13a formed on a dielectric substrate 13 surface. The band-like conductor 18b and the circuit pattern 13a are interconnected by a wire. <P>COPYRIGHT: (C)2012,JPO&INPIT |
