THERMALLY MOUNTING ELECTRONICS TO A PHOTOVOLTAIC PANEL

摘要

An electronics assembly for a photovoltaic panel is described wherein the assembly comprises: a substrate of a thermally conductive material, said substrate defining a thermal contact area for thermally contacting said electronics assembly to a photovoltaic panel; and, one or more electronic components provided on said substrate and in thermal contact with said substrate, so that when the electronics assembly is in thermal contact with said photovoltaic panel, said thermal contact providing a heat conductive channel between said electronic components and said photovoltaic panel, said heat conductive channel enabling said electronics assembly to use said photovoltaic panel as a heat sink for heat produced by said electronic compounds.