| 摘要 |
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-δ, Ca0.25Cu0.75TiO3-&bgr;, and TiO2-&sgr;, wherein δ, &bgr;, &sgr; denotes oxygen vacancies in corresponding accelerators and 0.05≦̸δ≦̸0.8, 0.05≦̸&bgr;≦̸0.5, and 0.05≦̸&sgr;≦̸1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer. |
