发明名称 WATERPROOF STRUCTURE OF CONDUCTION PATH
摘要 <P>PROBLEM TO BE SOLVED: To provide a waterproof structure of a conduction path which can make a conductor waterproof without putting unnecessary load on the conductor, and can gain sufficient creepage distance. <P>SOLUTION: A plurality of grooves 9 is formed on an outer peripheral surface 8 of an insulator 7. The grooves 9 are formed in a concave shape by heating or cutting. The grooves 9 are formed within a predetermined region L on the outer peripheral surface 8 of the insulator 7. The predetermined region L is set as a region where an overmold part 5 is provided. The overmold part 5 is a seal member made of elastomer, and disposed and formed within the predetermined region L of an electrical wire 2. Further, the overmold part 5 is formed so as to fill all the three grooves 9. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012038600(A) 申请公布日期 2012.02.23
申请号 JP20100178307 申请日期 2010.08.09
申请人 YAZAKI CORP 发明人
分类号 H01R13/52 主分类号 H01R13/52
代理机构 代理人
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