发明名称 SILICON WAFER AND MANUFACTURING METHOD
摘要 A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process.
申请公布号 US2012043644(A1) 申请公布日期 2012.02.23
申请号 US201013258962 申请日期 2010.03.25
申请人 ONO TOSHIAKI;ITO WATARU;FUJISE JUN;SUMCO CORPORATION 发明人 ONO TOSHIAKI;ITO WATARU;FUJISE JUN
分类号 H01L29/36;C30B19/08;C30B23/06;C30B25/10;H01L21/20;H01L29/32 主分类号 H01L29/36
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