发明名称 |
SILICON WAFER AND MANUFACTURING METHOD |
摘要 |
A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process.
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申请公布号 |
US2012043644(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US201013258962 |
申请日期 |
2010.03.25 |
申请人 |
ONO TOSHIAKI;ITO WATARU;FUJISE JUN;SUMCO CORPORATION |
发明人 |
ONO TOSHIAKI;ITO WATARU;FUJISE JUN |
分类号 |
H01L29/36;C30B19/08;C30B23/06;C30B25/10;H01L21/20;H01L29/32 |
主分类号 |
H01L29/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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