| 摘要 |
A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads and a first power lead arranged between the pair of first and second differential signal leads. One of the pairs of differential signal leads has half-double function transmission mode and two of the other pairs of differential signal leads have double function transmission mode.
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