| 摘要 |
An inspection device of a semiconductor integrated circuit includes a drive unit that moves a probe card back and forth and from side to side, a storage unit that stores arrangement of the semiconductor integrated circuit and a shape of the pads, and a control unit that controls the drive unit. The control unit controls the drive unit, performs an apex detection processing pressing the probe pin to the semiconductor integrated circuit, detecting positions of the probe pin where conduction is detected or not detected, and calculating coordinates of one apex of a inspection pad from detected positions, and calculates central coordinates of the inspection pad from information of the shape of the inspection pad based on the coordinates of the apex of the inspection pad. The drive unit presses the probe pin to the calculated central coordinates of the inspection pad to perform inspection.
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