发明名称 |
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE |
摘要 |
A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 diamond granules and 0 wt %-40 wt % oxide granules, grinding and polishing a top surface of the wafer, etching the top surface for eliminating a top process-induced degradation layer and maintaining a 0.5μm-10μm thick edge process-induced degradation layer.
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申请公布号 |
US2012043645(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US201113287670 |
申请日期 |
2011.11.02 |
申请人 |
ISHIBASHI KEIJI;MIKAMI HIDENORI;MATSUMOTO NAOKI;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
ISHIBASHI KEIJI;MIKAMI HIDENORI;MATSUMOTO NAOKI |
分类号 |
H01L29/20;B24B9/00;B24D3/00;B24D3/22;B24D3/32;H01L21/304;H01L21/306;H01L21/3065;H01L33/32 |
主分类号 |
H01L29/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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