| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emission diode, a frame formation method for the same, and a frame structure with an improved mold characteristic and structural strength. <P>SOLUTION: A single-material tape is first, second, and third frames positioned independently to face each other. A press molding process is performed on thin bottoms of first and second wire bonding parts 212 and 222 which extend from the first and second frames 21 and 22. The thickness of each of the first and second bonding parts is smaller than that of the third frame 23, so the third frame which is thicker than the two can be exposed to the outside of an adhesive body to achieve an improved dissipation effect, and at least one side between the two frames positioned independently to face each other is formed by a groove 24. When the frame is applied to a light emission diode and fixed on the adhesive body, the groove can enhance the coupling characteristic between the frame and the adhesive body and enhance the structural strength between them. <P>COPYRIGHT: (C)2012,JPO&INPIT |
