发明名称 METAL FOIL LAMINATE, SUBSTRATE FOR MOUNTING LED AND LIGHT SOURCE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal foil laminate having high heat resistance, high reflectance in a visible light region and small decrease in reflectance under a high temperature heat load environment, while being compatible to large area increase, excellent in metal adhesive property and usable for a printed circuit board for mounting an LED. <P>SOLUTION: A metal foil laminate is a laminate comprising a metal foil at least on one side of a resin layer (A) containing polyorganosiloxane and inorganic filler. In the metal foil laminate, 90 degrees peel strength between the resin layer (A) and the metal foil is equal to or more than 0.95 kN/m, average reflectance at wavelength 400-800 nm is equal to or more than 80% on an exposed surface when the metal foil is peeled off to expose the resin layer (A), and a reduction rate of reflectance at wavelength 470 nm is equal to or less than 5% after a heat treatment in 260&deg;C for 10 minutes. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012037829(A) 申请公布日期 2012.02.23
申请号 JP20100180129 申请日期 2010.08.11
申请人 MITSUBISHI PLASTICS INC 发明人
分类号 G02B5/08;F21S2/00;F21V7/00;F21Y101/02;H01L33/62;H05K1/03 主分类号 G02B5/08
代理机构 代理人
主权项
地址