| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide technique to reduce thermal interference between a plurality of heat sources of an image display device such as a liquid crystal display device and improve dust resistance and rigidity of the device. <P>SOLUTION: A heat spreader is provided to the inside of a bottom frame of a display panel module to form a double-sheet-metal structure. An LED substrate mounting an LED is provided on an opposite side surface of the bottom frame in the heat spreader. An LED drive substrate, a power source substrate, a signal substrate, etc. are provided to the outside of the bottom frame. A space with a predetermined size is provided between the bottom frame and the heat spreader, thereby reducing thermal interference between the LED substrate, the LED drive substrate, the power source substrate, and the signal substrate, etc., and improving dust resistance and rigidity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
