发明名称 |
DEVICE-EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.
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申请公布号 |
US2012043114(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US201113116224 |
申请日期 |
2011.05.26 |
申请人 |
CHO YANG-SIK;HONG SUNG-TAIK;WANG GUN-HO;SAMSUNG TECHWIN CO., LTD. |
发明人 |
CHO YANG-SIK;HONG SUNG-TAIK;WANG GUN-HO |
分类号 |
H05K1/09;H05K1/02;H05K3/02 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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