| 摘要 |
Disclosed herein are a board with a fine pitch bump and a method of manufacturing the same. The method of manufacturing a board with a fine pitch bump includes: forming a solder resist layer by stacking a solder resist on a core layer having a circuit pattern formed thereon; forming a seed layer on an upper surface of the solder resist layer; forming a dry film layer by stacking a dry film on an upper surface of the seed layer; forming holes by simultaneously drilling the solder resist layer, the seed layer, and the dry film layer; and forming a copper post bump by performing copper filling plating in the holes and removing the seed layer and the dry film layer. The holes having the same size are simultaneously drilled into the solder resist layer and the dry film layer to improve a matching degree of the copper post bump, thereby making it possible to form the fine pitch bump. |
