发明名称 PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
摘要 <p>The disclosed device has a ring shaped O-ring (29a), which is between a dielectric plate (28) and a support unit (13a) on a lid member (13), and has a spacer (60) which forms a gap (d), on the outer peripheral side of the O-ring (29a), between the dielectric plate (28) and the support unit (13a) of the lid member (13), the lid member being arranged above a processing container (1). Due to the gap (d), the lid member (13) and the dielectric plate (28) do not come into contact and become worn, even if the lid member (13) and the dielectric plate (28) thermally expand due to the heat of the plasma within the processing container (1), thus damage to the dielectric plate (28) and the generation of particles can be prevented.</p>
申请公布号 WO2011125704(A9) 申请公布日期 2012.02.23
申请号 WO2011JP57957 申请日期 2011.03.30
申请人 TOKYO ELECTRON LIMITED;YONEZAWA RYOTA;TAKAHASHI TETSURO;OSAKI YOSHINORI;SUZUKI KOUKI;SAITO TOMOHIRO;YAMASHITA JUN;SATO YOSHIHIRO;SHIOZAWA TOSHIHIKO;YAMAZAKI KOICHI;FURUKI KAZUHIRO 发明人 YONEZAWA RYOTA;TAKAHASHI TETSURO;OSAKI YOSHINORI;SUZUKI KOUKI;SAITO TOMOHIRO;YAMASHITA JUN;SATO YOSHIHIRO;SHIOZAWA TOSHIHIKO;YAMAZAKI KOICHI;FURUKI KAZUHIRO
分类号 C23C16/44;C23C16/50;H01L21/3065;H01L21/31;H05H1/46 主分类号 C23C16/44
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