| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an encapsulating resin composition excellent in a thermal expansion coefficient and flowability, capable of easily penetrating into a narrow gap. <P>SOLUTION: In this encapsulating resin composition including an epoxy resin, a curing agent, inorganic particles, an organic titanium compound and a phosphoric acid ester, the average particle size of the inorganic particles is ≤10 μm, the amount of the inorganic particles relative to a total amount of the composition is ≥60 mass%, the amount of the organic titanium compound relative to the total amount of the composition is ≥1 and ≤5 mass%, and the amount of the phosphoric acid ester relative to the total weight of the composition is ≥0.5 and ≤3 mass%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
