| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting method in which, when a plurality of first and second predetermined dividing lines crossing each other are cut, deterioration in processing quality generated in the first lines to be cut first can be reduced. <P>SOLUTION: When dicing is performed by cutting first and second predetermined dividing lines 2a and 2b in a form of a lattice, which partition a device region 3 in a semiconductor wafer 1, a cutting method comprises: a first cutting step for cutting the first predetermined dividing lines 2a so as to skip at least the adjacent first predetermined dividing lines 2a, for example, at intervals of one line or two lines, instead of first cutting all the first predetermined dividing lines 2a; thereafter a second cutting step for cutting the second predetermined dividing lines 2b; and thereafter a third cutting step for cutting the other first predetermined dividing lines 2a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
