| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting method which can prevent the processing quality from deteriorating and can allow planarization even in a wafer with a bump formed on it. <P>SOLUTION: A cutting method for cutting a reverse face of a wafer which has, on the surface, a bump formation region with multiple bumps formed and an outer periphery bump non-forming region to surround the bump formation region comprises: a adhesion step for adhering a protective tape on the surface of a wafer; a holding step for holding the surface of the wafer with the protective tape adhered to it by a chuck table through the protective tape; and a cutting step for rotating a cutting wheel having an outer diameter that a cutting grindstone passes through the rotation center of the wafer and the outer peripheral edge of the cutting grindstone passes through the outer periphery of the bump formation region and contacting the cutting wheel to the reverse face of the wafer held by the chuck table in order to form a circular concavity by cutting the reverse face of the wafer corresponding to the bump formation region while forming an annular convex including the outer periphery bump non-forming region in the outer peripheral side of the circular concavity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
