发明名称 SOLID STATE IMAGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid state imaging device capable of stably evaluating the linearity of column ADC circuits. <P>SOLUTION: The solid state imaging device comprises: pixels PC for outputting pixel signals VSIG subjected to photoelectric conversion; the column ADC circuits 12 for converting the pixel signals VSIG output from the pixels PC to digital values; an inspection signal generation unit 6 for generating inspection signals DAC for inspecting the column ADC circuits 12; and switch circuits 11 which input the pixel signals VSIG output from the pixels PC or the inspection signals DAC generated by the inspection signal generation unit 6 to the column ADC circuits 12, switching between both of the signals. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012039299(A) 申请公布日期 2012.02.23
申请号 JP20100176368 申请日期 2010.08.05
申请人 TOSHIBA CORP 发明人
分类号 H04N5/378 主分类号 H04N5/378
代理机构 代理人
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