发明名称 WIRE BONDING DEVICE AND WIRE BONDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wire bonding device which can easily supply stable supersonic vibration while maintaining the temperature of a wire at a high level. <P>SOLUTION: A horn 3 propagates supersonic vibration generated from a vibration element 2 to a capillary 6 attached to a end 3b. The horn 3 is provided, in the end 3b near the capillary 6, with a heater 3a which heats the horn 3 from the inside under control of a heater control unit 4. The heater 3a is formed to cover the section of the rod-like horn 3 in the width direction. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012038869(A) 申请公布日期 2012.02.23
申请号 JP20100176737 申请日期 2010.08.05
申请人 RENESAS ELECTRONICS CORP 发明人 SATO TAKEYUKI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
代理机构 代理人
主权项
地址