发明名称 MULTILAYER CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To suppress the occurrence of a crack having an influence on the performance of a multilayer circuit board, and prevent the penetration of noise in a multilayer circuit board. <P>SOLUTION: The multilayer circuit board 1 comprises: a board main body 3 having a structure such that each of conductive layers 22-25 is disposed between insulating layers 11-14; and a metal member 5 disposed under the board main body 3. The third conductive layer 23 has: a circuit formation part 28 for forming an electric circuit 6; and an outer side part 29 insulated from the circuit formation part 28 and disposed on the side of an outer peripheral part 3c of the board main body 3. The metal member 5 is insulated from the circuit formation part 28, and electrically connected with the outer side part 29 through a third via 33. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012038911(A) 申请公布日期 2012.02.23
申请号 JP20100177565 申请日期 2010.08.06
申请人 JTEKT CORP 发明人 NAGASE SHIGEKI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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