发明名称 METHOD OF MANUFACTURING ELECTRONIC UNIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing by which deformation can be prevented on a first printed circuit board located in other parts than the end part when a plurality of camera modules are set so as to perform pressurizing with a press-bonding head through a rubber board. <P>SOLUTION: In the method of manufacturing an electronic unit, anisotropic conductive materials are made to intervene between a plurality of first connection terminals 21b of first printed circuit boards 21a and a plurality of second connection terminals 30b of second printed circuit boards 30a composed of a flexible substrate, and the second connection terminals 30b are electronically connected to first connection terminals 21b respectively by pressurizing the second printed circuit boards with a press-bonding head. The method of manufacturing the electronic unit includes processes of: arranging the anisotropic conductive materials and a plurality of the second printed circuit boards in this order on a plurality of the first printed circuit boards; arranging a rubber board where a through hole 50a is formed on a section except for a section facing at least the second connection terminals 30b on a plurality of the second printed circuit boards; and pressurizing the second printed circuit boards with the press-bonding head through the rubber board. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012039027(A) 申请公布日期 2012.02.23
申请号 JP20100180073 申请日期 2010.08.11
申请人 KONICA MINOLTA OPTO INC 发明人 KIYOSUE SHIGENORI;KATAGIRI SADAHITO
分类号 H05K3/36 主分类号 H05K3/36
代理机构 代理人
主权项
地址