| 摘要 |
The present invention addresses the problem of providing a novel epoxy compound which gives a cured product exhibiting excellent performance with respect to heat resistance and low thermal expandability, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expandability. The curable composition comprises an epoxy compound and a curing agent as essential components, and as the epoxy compound, a novel calixarene-type epoxy compound having a resin structure represented by structural formula (1) (wherein R1 groups each independently represent a hydrogen atom, an alkyl group, or an alkoxy group; and n is a repeating unit and is an integer of 2 to 10) is used. |
