| 摘要 |
The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management. |
