发明名称 COMPARTMENTALIZED SHIELDING OF SELECTED COMPONENTS
摘要 Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.
申请公布号 US2012044653(A1) 申请公布日期 2012.02.23
申请号 US201113189838 申请日期 2011.07.25
申请人 MORRIS THOMAS SCOTT;MADSEN ULRIK RIIS;SAWYER BRIAN D.;SHAH MILIND;SIOMKOS JOHN ROBERT;CRANDALL MARK ALAN;CAREY DAN;RF MICRO DEVICES, INC. 发明人 MORRIS THOMAS SCOTT;MADSEN ULRIK RIIS;SAWYER BRIAN D.;SHAH MILIND;SIOMKOS JOHN ROBERT;CRANDALL MARK ALAN;CAREY DAN
分类号 H05K7/00;H05K13/00 主分类号 H05K7/00
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