PIN SOLDERING FOR PRINTED CIRCUIT BOARD FAILURE TESTING

摘要

Systems and methods for performing pin-pull testing of a printed circuit board (PCB) are presented. The pin-pull testing generally involves the use of a standard tensile tester (202) that is useful for performing other tests aside from pin-pull testing. In this regard, a non-specific pin (100) may be used in conjunction with the tensile tester (202) without the need to purchase or manufacture pins specially adapted for use with a specially designed tensile tester. Additionally, the pin-pull testing may include application of heat to the pin by way of an external heat supply (140) such that the need of a heater integrated into the testing device to heat a pin during the testing may be eliminated. As such, a common heating element (e.g., a standard soldering iron) may be employed by applying heat to a pin (100) directly with the external heat supply (140). Additionally, a dying process is presented that may be performed on a PCB prior to the pin-pull test that allows for evaluation of the presence of cracks (402) in the PCB (130) adjacent to a contact pad (132) prior to the execution of the pin-pull test.