发明名称 In-situ endpoint control apparatus for semiconductor wafer polishing process
摘要 Endpoint determination of a wafer removal process, in-situ, is afforded by the use of a Kalman filter known to be useful in celestial navigation. The use of line variable displacement transducers provides position error correction for the Kalman filter and the Preston equation provides the initial calibration for the endpoint determination. Accuracies of fifty angstrom are achieved.
申请公布号 US5865665(A) 申请公布日期 1999.02.02
申请号 US19970800769 申请日期 1997.02.14
申请人 YUEH, WILLIAM 发明人 YUEH, WILLIAM
分类号 B24B49/00;(IPC1-7):B24B49/00;B24B51/00 主分类号 B24B49/00
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