| 摘要 |
PURPOSE: An etchant composition is provided to have excellent etching performance to metal layer comprising copper and titanium, to simplify etching process, and to improve productivity. CONSTITUTION: An etchant composition for a metal layer with copper and titanium comprises 5-20 weight% of persulfate, 0.01-2 weight% of a fluorine-containing compound, 1-10 weight% of inorganic acid, 0.3-5 weight% of a cyclic amine compound, 0.1-5 weight% of a chlorine-containing compound, 0.1-5 weight% of a phosphate, and residue water. The persulfate is at least one selected from a group consisting of ammonium persulfate, sodium persulfate, and potassium persulfate. The inorganic acid is at least one selected from nitric acid, sulfuric acid, phosphoric acid, and perchloric acid.
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