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发明名称
Heat pump
摘要
<p>A heat pump including a boiler is disclosed. The heat pump may include the boiler which may be selectively operated based on a temperature of external air or an electric power rate per unit heat quantity.</p>
申请公布号
EP2420747(A2)
申请公布日期
2012.02.22
申请号
EP20110177799
申请日期
2011.08.17
申请人
LG ELECTRONICS, INC.
发明人
NOH, JINHEE;PAIK, WOOHYUN;PARK, HEEWOONG;PARK, NOMA;CHOI, HWANJONG;HA, SAMCHUL
分类号
F24D3/18;F24D17/02
主分类号
F24D3/18
代理机构
代理人
主权项
地址
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