THREE-DIMENSIONALLY STACKED PACKAGE AND THE FABRICATION METHOD USING FLIP CHIP BONDING
摘要
PURPOSE: A 3D stacked package through flip chip bonding and a manufacturing method thereof are provided to prevent the degradation and damage of a monomer by including a rigid plate which is thicker than a semiconductor chip. CONSTITUTION: A semiconductor chip(10) is mounted on a flexible board(20). The flexible board includes a conductive pattern(2) and via(v). The conductive pattern is formed on a mounting surface which the semiconductor chip is mounted on. The conductive pattern and via are connected. The via passes through the mounting surface and an opposite side of the mounting surface.
申请公布号
KR20120015486(A)
申请公布日期
2012.02.22
申请号
KR20100077623
申请日期
2010.08.12
申请人
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人
CHAE, JANG SOO;PARK, MI YOUNG;CHO, HEE KEUN;RYU, KWANG SUN