| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that an electronic component formed by embedding a coil in a compact molded by the use of a metal magnetic material shows substantial deterioration in insulating resistance due to heat, thus bringing a concern that an increasing time-dependent loss by heat generation resulting from a flow of large current or by operation in a hot place may lead to an insulation failure or pressure resistance failure. <P>SOLUTION: The compact incorporating the coil therein is molded using the metal magnetic material formed by coating the surface of metal magnetic material powder with glass. The compact is subjected to heat treatment in a low-oxygen concentration atmosphere under temperatures of 800°C or higher. Because the compact incorporating the coil therein is molded using the metal magnetic material formed by coating the surface of the metal magnetic material power with glass and the compact is subjected to heat treatment in the low-oxygen concentration atmosphere under temperatures of 800°C or higher, the manufactured electronic component offers a high insulating property without an increase in manufacturing processes, and shows less deterioration in insulating resistance due to heat than a conventional electronic component. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
