发明名称 |
RADIATION SUBSTRATE FOR POWER LED AND POWER LED PRODUCTION AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention provides manufacturing methods for a power LED substrate with a mounting hole and a heat sink and for its power LED product and products thereof. The disclosed fabrication methods for power LED heat-dissipating substrate include the following steps a) selecting substrate material and processing; b) fabricating heat sink; c) assembling substrate and heat sink. The manufacturing methods of power LED products are based upon the manufacturing methods for heat-dissipating substrate, including the following steps: mounting LED die, bonding wire, packaging, post hardening, separating components, testing, classifying, and taping. |
申请公布号 |
EP2421038(A1) |
申请公布日期 |
2012.02.22 |
申请号 |
EP20090842857 |
申请日期 |
2009.04.10 |
申请人 |
FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD |
发明人 |
YU, BINHAI;LI, JUNZHENG;XIA, XUNLI |
分类号 |
H01L25/075;H01L23/367;H01L25/13;H01L33/00 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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