| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connector which can be easily thinned and miniaturized, securing thinning of the connector and its rigidity produced attendantly on thinning, which cannot be obtained by a resin frame because of its limit, by insulatingly bonding a contact formed of a metallic member to a frame formed of a metallic plate member, differently from the frame formed by a conventional resin member. <P>SOLUTION: The connector is composed of a frame provided with a bonding part to insulatingly bond the contact to the metallic plate member, and the contact formed of the metallic member while having a contact part and a terminal part. An insulating film is applied to the bonding part, an insulating film is applied to portions excluding the contact part and the terminal part of the contact, and the portion of the contact to which the insulating film has been applied is bonded to the bonding part to which the insulating film has been applied. <P>COPYRIGHT: (C)2010,JPO&INPIT |
