| 摘要 |
PROBLEM TO BE SOLVED: To prevent the undesirable formation of a projected part on the surface of a bump electrode at forming the bump electrode (projected electrode) by a plating method. SOLUTION: During a predetermined time from the start of a plating process, a metal film of an underlayer is etched in an predetermined quantity, and a projected part at the surface of the metal film of the underlayer is removed by applying an alternate current of a predetermined quantity of a current. Subsequently, the metal film is grown to form a bump electrode by applying, for a predetermined period, the alternate current having a waveform where only a polarity element rises in a predetermined quantity for the growth of the metal film to form the bump electrode among current waveforms of such alternate currents. COPYRIGHT: (C)2007,JPO&INPIT |
